Paul Redmond is multi-talented metallurgist, with more than 19 years of failure analysis and material recommendation experience serving the needs of national and international clientele encompassing petroleum exploration, refineries, chemical, commercial nuclear power, and fossil fuel power industries. His strengths include analytical acumen, demonstrated project management expertise, communication, customer service, and expertise in API RP 571, 579, and 580, with API 571 Certification (60831).

Prior to working for The Hendrix Group, Mr. Redmond held responsible positions with Weatherford International, The Southwest Research Institute, and Thielsch Engineering. He is an active member of ASM International, a past chair of the ASM Alamo Chapter, and is active in the ASM Houston Chapter. Mr. Redmond has an Master of Science in Materials Engineering from Worcester Polytechnic Institute and a Bachelor of Science in Geology from Northeastern University.

Publications and Presentations

  • “Examination and Review of Contaminants in Sales Gas Pipelines”; P. E. Redmond and R. M. Baldwin P.E.; presented at the 2010 Materials Science & Technology Conference & Exhibition.
  • “Failure Analysis of Four Graphite Pump Seal Faces”; P. E. Redmond; presented at the 2009 Materials Science & Technology Conference & Exhibition.
  • “Case Study; A Failure Analysis of a Pinion Thrust Runner Shaft”; P. E. Redmond, T. C. Allison Ph.D., H. R. Simmons, P.E., A. C. Jurin and A. A. Bernal; presented at the 2009 Materials Science & Technology Conference & Exhibition.
  • “An Investigation of Microbiologically Induced Corrosion of Hypercompresser Slider Bearings”; P. E. Redmond J. R. Becker; presented at the 2007 Materials Science & Technology Conference & Exhibition.
  • “A Failure Analysis Investigation of Pitting in Type 316L Piping Bearing Seawater Used for Cooling”; P. E. Redmond and N. Sridhar, Ph.D.; presented at the NACE Central Area Conference 2006.
  • “Thermomechanical Fatigue Behavior of Lead Free Solder Alloys”; P. E. Redmond, M. A. Palmer; A report included in the Technical Library of the Lead Free Solder Project, National Center for Manufacturing Sciences, -- 1997, (available to NCMS Membership 8/98, General Public 8/99).
  • “Thermomechanical Fatigue Testing and Analysis of Solder Alloys”; M. A. Palmer, P. E. Redmond, and R. W. Messler Jr.; Journal of Electronic Packaging, March 2000, pp 48-54.
  • “Thermomechanical Fatigue Testing of Solder Alloys”; M. A. Palmer, P. E. Redmond, R. W. Messler; TMS Spring 1997 Meeting.
  • “The Structure-Property-Process Relationship and Thermomechanical Fatigue Behavior of Eutectic Sn-Ag and Sn-Bi Solder Alloys”; P. E. Redmond, M. A. Palmer, R. W. Messler and D. Millard; Augmentation Award For Science and Engineering Research Traineeship (AASERT Contract No. N00014-93-1-1295) Technical Report.
  • “Quantitative Microstructural Analysis of Zirconia Toughened Ceramics Using Digital Image Processing”; by J. Hefter, J. Harris. P. E. Redmond, G. L. Leatherman. Presented at the 93rd Annual Meeting of the American Ceramic Society in Cincinnati, OH as a Characterization Technique in the Basic Science Division.

 

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